Resources

Enabling the Future of Quantum

Quantum Computing Capabilities

Accelerate Innovation in High-Growth Markets

Quick-turn Manufacturing Capabilities

Strength in Flexibility with High-Velocity Manufacturing

Box Build Capabilities

Strength in Flexibility with High-Velocity Manufacturing

EMS Integration & Test Capabilities

Repatriating PCBA Production

Published in Microwave Journal

Custom Solutions from Wafer Probe to Final Test

Dynamic Test Solutions Case Study

ATE PCBs Demand Quick Turn and High Quality

Published in EE Web

Unleashing Quantum Potential

Published on SMTnet

Delivering Custom RF Amplifiers

Broadband Wireless Case Study

Improving Health Through Nutrition Insight

Opsis Health Case Study

Space-Qualified Electronics Manufacturing

Published in Global SMT & Packaging

International Traffic In Arms Regulation (ITAR)

Naprotek - 90 Rose Orchard Way

International Traffic In Arms Regulation (ITAR)

Naprotek - 2085 Zanker Road

Quality Management Systems

ISO 9001:2015 - 90 Rose Orchard Way

Quality Management Systems

ISO 9001:2015 - 2085 Zanker Road

QMS — Aviation, Space, and Defense

AS9100D - 90 Rose Orchard Way

QMS — Aviation, Space, and Defense

AS9100D - 2085 Zanker Road

QMS — Medical Devices

ISO 13485:2016 - 90 Rose Orchard Way

QMS — Medical Devices

ISO 13485:2016 - 2085 Zanker Road

Quality at Naprotek

Conflict Minerals Statement

CMRT 6.4 Conflict Minerals Report

90 Rose Orchard Way

CMRT 6.4 Conflict Minerals Report

2085 Zanker Road

Quality at Naprotek

RoHS Compliance Statement

Quality at Naprotek

REACH Compliance Statement

Quality at Naprotek

Prop 65 Compliance Statement

Quality at Naprotek

Terms & Conditions of Purchase

Quality at Naprotek

Terms & Conditions of Sale

Thin Film Circuit Design Guidelines

Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits

Tech Brief

Eutectic Die-Attach of GaN and GaAs MMICs

Tech Brief

Tips for Increasing Yields when Wire Bonding Small MESA Chips

Tech Brief

How RF and Microwave Companies Can be Empowered by US-based Contract Manufacturing

Tech Brief

PCB Microelectronics Assembly Takes Center Stage for Medical Miniaturization

Published in Medical Design Briefs

PCBs on the Medical Ventilator Frontlines

Published in EE Web

3 key steps for IoT PCB SMT and microelectronics assembly

Published by IoT Agenda

Understand the basics of multi-tier wire bonding

Published by IoT Agenda

Epoxy’s role in IoT device PCB assembly and manufacturing

Published by IoT Agenda

Protect IoT bare dies and wire bonds for high reliability

Published by IoT Agenda

IoT PCB microelectronics manufacturing calls for intricate tools

Published by IoT Agenda

PCB Microelectronics Tools for Intricate Inspection and Calibration

Published in EE Web

Die Attach Comes to PCBs

Published in EE Web

Get linked up with anisotropic conductive film for your IoT devices

Published by IoT Agenda

Revisiting ISO 13485 For Wire Bonding Quality and Reliability

Published in EE Web

Failures in IoT PCB wire bond loops

Published by IoT Agenda

Ensure IoT device reliability via die shear strength testing

Published by IoT Agenda

Pinpoint IoT PCB wire bonding reliability

Published by IoT Agenda

Get your wires straight for IoT

Published by IoT Agenda

PADS accelerates IoT PCB design

Published by IoT Agenda

Key Design Steps for DUT Areas on ATE PCBs

Published in EE Web

Anatomy of next-gen IoT PCBs

Published by IoT Agenda

A careful look at RF for your IoT PCBs

Published by IoT Agenda

Anatomy of ATE PCB Assembly

Published in EE Times

Flex Circuit Design Primer for Wearable/IoT Device

Published in EE Times

Wearable PCB Designs Require Attention to Fundamentals

Published in EE Times

7 Tips for Overcoming PCB Electromagnetic Issues

Published in EE Times

DOEs Rescue Questionable Medical Electronics PCBs

Published in Medical Design Briefs

Avoiding embedded PCB design defects

Published in Embedded

Making efficient use of BGA signal routing in PCB designs

Published in Embedded

Bringing experimental development methods to PCB design and manufacturing

Published in Embedded

Characteristics of a Third-Level PCB Assembly

Published in Printed Circuit Design & Fab

Overlooking design-for-test can lead to costly PCB design rework

Published in Embedded

PCB Design and Assembly for Medical Electronic OEMs

Published in EE Web

Tighter Scrutiny Needed for PCB Cleaning Agents

Published in SMT007

Applying Design for Manufacturing (DFM) to PCB development

Published in Embedded

Uncovering Assembly Problems of High-Speed PCBs

Published in SMT007

The Basics of Thermal Profiling for Sensitive Components

Published in Circuits Assembly

Migrating your embedded PCB design from DDR2/3 to DDR4 SDRAMs

Published in Embedded

Yardsticks for Gauging AOI Effectiveness

Published in Circuits Assembly

EMS Discovers Mature IC Technologies

Published in SMT Magazine

Design Practices for Panelization and Depanelization

Published in Printed Circuit Design & Fab

Get Another Look Into AOI

Published in SMT Magazine

Seven ways to avoid embedded PCB engineering change orders

Published in Embedded

Using Forensics to Improve PCB Design and Assembly

Published in Printed Circuit Design & Fab

Saving your embedded printed circuit board design with forensic technology

Published in Embedded

Critical guidelines for RF and microwave PCB Design

Published in Embedded

High-Reliability PCBs in Mil/Aero Applications

Published in The PCB Magazine

FAI: An Ounce of Prevention, Worth a Pound of Cure

Published in SMT Magazine

The Intricacies of RF Design and Assembly

Published in SMT Magazine

Building quality & signal integrity into PoP-based PCB design & assembly

Published in Embedded

Building quality & signal integrity into PoP-based PCB design & assembly

Published in Embedded