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SERVICES FOR HIGH-RELIABILITY APPLICATIONS
Discover how Naprotek's expert manufacturing services are enabling the technologies of the future. To search all of our resources, use the filter below. If you're interested in learning more about our services please Contact Us.
Delivering Custom RF Amplifiers
Broadband Wireless Case Study

Custom Solutions from Wafer Probe to Final Test
Dynamic Test Solutions Case Study

Improving Health Through Nutrition Insight
Opsis Health Case Study

ATE PCBs Demand Quick Turn and High Quality
Published in EE Web

Space-Qualified Electronics Manufacturing
Published in Global SMT & Packaging

International Traffic In Arms Regulation (ITAR)
Naprotek - 90 Rose Orchard Way

International Traffic In Arms Regulation (ITAR)
Naprotek - 2085 Zanker Road

Quality Management Systems
ISO 9001:2015 - 90 Rose Orchard Way

Quality Management Systems
ISO 9001:2015 - 2085 Zanker Road

QMS — Aviation, Space, and Defense
AS9100D - 90 Rose Orchard Way

QMS — Aviation, Space, and Defense
AS9100D - 2085 Zanker Road

QMS — Medical Devices
ISO 13485:2016 - 90 Rose Orchard Way

QMS — Medical Devices
ISO 13485:2016 - 2085 Zanker Road

Quality at Naprotek
Quality Clauses

Sustainability & Environmental Responsibility
Conflict Minerals Statement

Thin Film Circuit Design Guidelines

Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits
Tech Brief

Eutectic Die-Attach of GaN and GaAs MMICs
Tech Brief

Tips for Increasing Yields when Wire Bonding Small MESA Chips
Tech Brief

How RF and Microwave Companies Can be Empowered by US-based Contract Manufacturing
Tech Brief

PCB Microelectronics Assembly Takes Center Stage for Medical Miniaturization
Published in Medical Design Briefs

PCBs on the Medical Ventilator Frontlines
Published in EE Web

3 key steps for IoT PCB SMT and microelectronics assembly
Published by IoT Agenda

Understand the basics of multi-tier wire bonding
Published by IoT Agenda

Epoxy’s role in IoT device PCB assembly and manufacturing
Published by IoT Agenda

Protect IoT bare dies and wire bonds for high reliability
Published by IoT Agenda

IoT PCB microelectronics manufacturing calls for intricate tools
Published by IoT Agenda

PCB Microelectronics Tools for Intricate Inspection and Calibration
Published in EE Web

Die Attach Comes to PCBs
Published in EE Web

Get linked up with anisotropic conductive film for your IoT devices
Published by IoT Agenda

Revisiting ISO 13485 For Wire Bonding Quality and Reliability
Published in EE Web

Failures in IoT PCB wire bond loops
Published by IoT Agenda

Ensure IoT device reliability via die shear strength testing
Published by IoT Agenda

Pinpoint IoT PCB wire bonding reliability
Published by IoT Agenda

Get your wires straight for IoT
Published by IoT Agenda

PADS accelerates IoT PCB design
Published by IoT Agenda

Key Design Steps for DUT Areas on ATE PCBs
Published in EE Web

Anatomy of next-gen IoT PCBs
Published by IoT Agenda

A careful look at RF for your IoT PCBs
Published by IoT Agenda

Anatomy of ATE PCB Assembly
Published in EE Times

Flex Circuit Design Primer for Wearable/IoT Device
Published in EE Times

Wearable PCB Designs Require Attention to Fundamentals
Published in EE Times

7 Tips for Overcoming PCB Electromagnetic Issues
Published in EE Times

DOEs Rescue Questionable Medical Electronics PCBs
Published in Medical Design Briefs

Avoiding embedded PCB design defects
Published in Embedded

Making efficient use of BGA signal routing in PCB designs
Published in Embedded

Bringing experimental development methods to PCB design and manufacturing
Published in Embedded

Characteristics of a Third-Level PCB Assembly
Published in Printed Circuit Design & Fab

Overlooking design-for-test can lead to costly PCB design rework
Published in Embedded

PCB Design and Assembly for Medical Electronic OEMs
Published in EE Web

Tighter Scrutiny Needed for PCB Cleaning Agents
Published in SMT007

Applying Design for Manufacturing (DFM) to PCB development
Published in Embedded

Uncovering Assembly Problems of High-Speed PCBs
Published in SMT007

The Basics of Thermal Profiling for Sensitive Components
Published in Circuits Assembly

Migrating your embedded PCB design from DDR2/3 to DDR4 SDRAMs
Published in Embedded

Yardsticks for Gauging AOI Effectiveness
Published in Circuits Assembly

EMS Discovers Mature IC Technologies
Published in SMT Magazine

Design Practices for Panelization and Depanelization
Published in Printed Circuit Design & Fab

Get Another Look Into AOI
Published in SMT Magazine

Seven ways to avoid embedded PCB engineering change orders
Published in Embedded

Using Forensics to Improve PCB Design and Assembly
Published in Printed Circuit Design & Fab

Saving your embedded printed circuit board design with forensic technology
Published in Embedded

Critical guidelines for RF and microwave PCB Design
Published in Embedded

High-Reliability PCBs in Mil/Aero Applications
Published in The PCB Magazine

FAI: An Ounce of Prevention, Worth a Pound of Cure
Published in SMT Magazine

The Intricacies of RF Design and Assembly
Published in SMT Magazine

Building quality & signal integrity into PoP-based PCB design & assembly
Published in Embedded

Building quality & signal integrity into PoP-based PCB design & assembly
Published in Embedded
