Custom Solutions from Wafer Probe to Final Test
In order to support the testing demands of a wide variety of semiconductor devices, chip and automated test equipment manufacturers depend on the...
Manufacturing
Transformation Capabilities with Accelerated Time-to-Test
Manufacturing
Built for Quality, Velocity, and High-Mix PCBA Manufacturing
Microelectronics
RF/Microwave Assembly and Testing to MIL-STD
Microelectronics
Fully Equipped RF Testing and Screening Lab to MIL-STD
Engineering
Design for the Most Demanding Conditions in Harsh Environments
Engineering
From Custom RF Circuits to Manufacturing Readiness
Rapid Prototyping
Delivering Quick Turn Printed Circuit Boards in about 1-5 Days
Rapid Prototyping
Producing Circuits with Speed with Rapid Change Management
New Product Introduction
Streamlining the Ramp-to-Production
New Product Introduction
Reduced cycle times for production
Test & Inspection
Complex and Dense ATE Boards
Test & Inspection
Turnkey Electrical and Quality Services Include MIL-PRF and MIL-STD Screening
Integration & Box Build
Robust, Reliable and Repeatable
Integration & Box Build
Collaborating Closely with Our Customers to Deliver Electronics Solutions
Supply Chain
Sourcing from Distribution, Direct-from-Customer, or Kitting Partners
Supply Chain
Flexible Sourcing with Turnkey, Consigned, and Hybrid Models
TECH BRIEF
Leveraging the Precision of Ion Beam Milling vs. Chemical Etching of Thin Film Circuits
TECH BRIEF
Next-Gen Anisotropic Ion Beam Milling Process is Proving to be Precise, Repeatable, and Clean
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